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2021年12月，承擔(dān) 中國科學(xué)院特別研究助理擇優(yōu)支助項(xiàng)目-大功率射頻微系統(tǒng)三維異質(zhì)集成與近結(jié)高效冷卻技術(shù)

2022年1月，承擔(dān) 國家自然科學(xué)基金青年項(xiàng)目-基于微流道晶圓重構(gòu)的三維集成芯片冷卻關(guān)鍵技術(shù)研究

2024年1月，承擔(dān)國家自然科學(xué)基金“集成芯片前沿技術(shù)科學(xué)基礎(chǔ)”重大研究計(jì)劃培育項(xiàng)目-面向集成芯片萬瓦級散熱的膜基薄液膜沸騰關(guān)鍵技術(shù)研究

2021年7月，參與北方集成電路技術(shù)創(chuàng)新中心(北京)有限公司合作項(xiàng)目-Chiplet三維封裝大功率熱點(diǎn)的一體化微流道冷卻技術(shù)

2021年11月，參與中國科學(xué)院先導(dǎo)A類項(xiàng)目

[1] Chen C, Hou F, Su M, et al. Pressure Drop and Thermal Characteristic Prediction for Staggered Strip Fin Microchannel[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(3): 435-443. (SCI，IF=1.89)

[2] Chen C, Su M, Ma R, et al. Analytical Assessment of the Effect of Thermal Interface Layer Voids on Temperature in Lid-Integral Microchannel Coldplate Cooling[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(6): 1000-1009. (SCI，IF=1.89)

[3] Chen C , Hou F , Ma R , et al. Design, Integration and Performance Analysis of a Lid-Integral Microchannel Cooling Module for High-Power Chip[J]. Applied Thermal Engineering, 2021(8):117457. (SCI，IF=5.295)

[4] Chen C, Su M, Ma R, et al. Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process[J]. Materials. 2022, 15(5). (SCI，IF=3.748)

[5] Song Y, Fu R, Chen C*, et al. Case-embedded Cooling for High Heat Flux Microwave Multi-chip Array[J]. Applied Thermal Engineering, 2022:118852. (SCI，IF=6.465)

[6] Liu D, Chen C*, Su M, et al. Hygro-thermal Analysis of Embedded Device Package in Reflow Process[C]. Electronics System-Integration Technology Conferences, Sibiu, Romania, 13-16 Sept. 2022.

[7]Song Y, Chen C*, Wang Q, et al. Comparison of Different Cooling Schemes for AlGaN/GaN HEMTs[J]. Micromachines, 2024, 15(1): 33. (SCI，IF=3.4)

[8]Zhang Y*, Zhao C, Yu C, Li Y,? Guo Y, Zhang Y, Chen C*, Cao L. High-linearity Graphene-based Temperature Sensor Fabricated by Laser Writing[J]. Journal of Materials Science: Materials in Electronics, 2024, 35(2): 109. (SCI，IF=2.22)

[9] Chen H; Chen C.; Zhou Y, et al. Evaluation and Optimization of a Cross-Rib Micro-Channel Heat Sink[J]. Micromachines. 2022, 13(1):132. (SCI，IF=3.523)

[10] Hou F, Wang W, Zhang H, Chen C, et al, Experimental evaluation of a coMPact two-phase cooling system for high heat flux electronic packages[J], Applied Thermal Engineering, 2019, 163, No. 114338. . (SCI，IF=5.295)