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代表性論文：

1.?Zemeng Feng?, Ziyi Hu1?, Tong Yu?, Panpan Lai, Rui Ge, Hua Shao, Dashan Shang, Zhiqiang Li, Kui Xu, Junjie Li*, Rui Chen*, and Ling Li, First large-scale (68×25×5 nm3) atomistic modeling for accurate and efficient etching process based on machine learning molecular dynamics (MLMD). 2024 IEEE International Electron Devices Meeting (IEDM). IEEE, 2024.

2.??Ziyi Hu, Junjie Li, Rui Chen*, Dashan Shang, Yayi Wei*, Zhongrui Wang*, Ling Li, Lado Filipovic, A two-step dry etching model for non-uniform etching profile in gate-all-around field-effect transistor manufacturing. Small, 2024, 2405574.

3.?Zhenjie Yao, Ziyi?Hu, Panpan Lai, Fengling Qin, Wenrui Wang, Zhicheng Wu, Lingfei Wang, Hua Shao, Yongfu Li, Zhiqiang Li, Zhongming Liu, Junjie Li*, Rui Chen*, Ling Li, Etching process prediction based on cascade recurrent neural network. Engineering Applications of Artificial Intelligence, 139 (2025): 109590.

4.?Hua Shao, Tobias Reiter, Rui Chen*, Junjie Li*, Ziyi Hu, Yayi Wei*, Ling Li, Lado Filipovic, Loading Effect during SiGe/Si Stack Selective Isotropic Etching for Gate-All-Around Transistors. ACS Applied Electronic Materials 6.11 (2024): 8124-8133.

5.?Ziyi Hu, Lado Filipovic, Junjie Li, Lingfei Wang, Zhicheng Wu, Rui Chen*, Yayi Wei*, and Ling Li, Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETs. 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). IEEE, 2024: 1-4.

6.?Jichang Yang?, Hegan Chen1?, Jia Chen, Songqi Wang, Shaocong Wang, Yifei Yu, Bo Wang, Ning Lin, Xinyuan Zhang, Rui Chen, Zhongrui Wang*, Dashan Shang*, Han Wang*, Qi Liu, and Ming Liu, Conditional Diffision Model Acceleration with First-Demonstrated RRAM-based In-memory Neural Differential Equation Solver. 2024 IEEE International Electron Devices Meeting (IEDM). IEEE, 2024.

7.?Qing Zhang, Yuhang Zhang, Rui Chen, Wei Lu, Huajie Huang, Zhiqiang Li*, and Yongfu Li*, pFed-Litho: Lithography Modeling With a Personalized Federated Learning Based Framework.?IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems?(2024).

8.? Ziyi Hu, Hua Shao*, Junjie Li, Panpan Lai, Wenrui Wang, Chen Li, Qi Yan, Xiaobin He, Junfeng Li, Tao Yang, Rui Chen*, Yayi Wei*, Modeling of Micro-trenching and Bowing Effects in Nano-scale Si Inductively Coupled Plasma?Etching Process, Journal of Vacuum Science & Technology A, 41(6) (2023).

9.? Enxu Liu, Junjie Li*, Na Zho, Rui Chen*, Hua Shao, Jianfeng Gao, Qingzhu Zhang, Zhenzhen Kong, Hongxiao Lin, Chenchen Zhang, Panpan Lai, Chaoran Yang, Yang Liu, Guilei Wang*, Chao Zhao, Tao Yang, Huaxiang Yin, Junfeng Li, Jun Luo, Wenwu Wang, Study of Selective Dry Etching Effects of 15-Cycle Si0.7Ge0.3/Si Multilayer Structure in Gate-All-Around Transistor Process, Nanomaterials, 13(14):2127?(2023).

10.?Hua Shao, Rui Chen*, Lisong Dong, Chen Li, Qi Yan, Taian Fan, and Yayi Wei*, High Accuracy Simulation of Silicon Oxynitride Film Grown by Plasma Enhanced Chemical Vapor Deposition, IEEE Transactions on Semiconductor Manufacturing, 35(2): 309-317 (2022)